Cambodia, Japan Sign Additional Loan and Grant Aid of Over US$55 Million

Cambodia and Japan signed here this morning the Exchange of Notes and the accompanying documents on the extension of additional loan and grant aid of more than JPY 7,571 million (approximately US$55.27 million) to support the former’s socio-economic development efforts.

H.E. Prak Sokhonn, Cambodian Deputy Prime Minister, Minister of Foreign Affairs and International Cooperation, and H.E. UENO Atsushi, Ambassador of Japan were the signatories.

According to a press release of the Cambodian Ministry of Foreign Affairs and International Cooperation AKP received this afternoon, of the total amount, JPY 7,205 million (approximately US$52.6 million) is a loan for the National Road No.5 Improvement Project (Prek Kdam – Thlea Ma`am Section) (IV).

The rest, JPY 366 million (approximately US$2.67 million) is a grant aid for the Project on Human Resource Development Scholarship, it added.

On behalf of the Royal Government and people of Cambodia, H.E. DPM Prak Sokhonn expressed his gratitude to the Government and people of Japan for their continued assistance to the Kingdom of Cambodia through the assistance and cooperation that contribute to the efforts of Cambodia in its socio-economic development, including infrastructure development, health, education, water supply, security and defence, peacekeeping operations, people-to-people connectivity, mine clearance and so on.

Source: Agence Kampuchea Presse